Copper CMP slurry is an abrasive that is used in semiconductor manufacturing and which can polish with micro fineness semiconductor substrate surfaces containing metal, dielectrics, etc. Based on electrochemical reactions and the technology for many functional materials, this slurry contributes to high-speed and uniform copper polishing while controlling dishing and erosion. It is also possible to achieve the polishing selection ratio desirable for individual substrates. With manufacturing facilities in Europe, the US, Taiwan, China, Korea and Japan, FUJIFILM Electronic Materials supplies to the world’s top tier semiconductor manufacturers, based on own technology.
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